Corporate

New Fab Expansion at Sony Device Technology (Thailand) Co., Ltd.

March 28th, 2024

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Corporate

New Fab Expansion at Sony Device Technology (Thailand) Co., Ltd.

March 28th, 2024

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Photo: Mr. Terushi Shimizu, President and CEO of Sony Semiconductor Solutions Corporation (center),  Mr. Yoshihiro Yamaguchi, President of Sony Semiconductor Manufacturing (4th person from the left), and Mr. Takeshi Matsuda, Managing Director of Sony Device Technology (Thailand) Co., Ltd. (3rd person from the left), along with Mr. Masato Otaka, Ambassador of Japan to Thailand, and Mr. Wirat Tatsaringkansakul, Deputy Secretary General of the Board of Investment (BOI), attend the opening ceremony if the new semiconductor manufacturing facility at Sony Device Technology (Thailand) Co., Ltd., located in the Bangkadi Industrial Park, Pathum Thani.

 

(PathumThani / 28 March 2024) — Sony Semiconductor Solutions Corporation today announced that, starting in February 2024, it has begun the operations with several production lines at the new fab built on the premises of Sony Device Technology (Thailand) Co., Ltd. (“SDT”), a production center responsible for assembly processes of semiconductors. The opening ceremony was held today, officiated by top executives from Sony Semiconductor Solutions Group led by Terushi Shimizu, President and CEO of Sony Semiconductor Solutions and Yoshihiro Yamaguchi, President of Sony Semiconductor Manufacturing, SDT Managing Director Takeshi Matsuda. It was witnessed by guests including Mr. Phasakorn Boonyalak, Governor of Pathum Thani Province, Japan’s Ambassador to Thailand, Mr. Masato Otaka, Mr. Wirat Tatsaringkansakul, BOI Deputy Secretary General and other VIPs.

 




SDT serves as a production center for the assembly of the main product line within Sony’s Imaging & Sensing Solutions business. The new fab, dubbed “Building 4,” will be utilized for the assembly of image sensors for automotive applications and display devices as well as the mass production of laser diodes for data center application.

 

Going forward, SDT plans to expand production facilities at Building 4 in line with market trends, while also planning to create approximately 2,000 new jobs with this new operation, thereby contributing to local employment and expanding the semiconductor industry in Thailand.

In addition, SDT has been operating its facilities on 100% renewable energy since fiscal year 2021. In the clean room of Building 4, the air conditioning system controls cleanliness, temperature and humidity by focusing on areas of need, and recycling technology for waste heat and hot water has also been adopted. Furthermore, SDT plans to cover the roof area of Building 4 with solar panels, with operations scheduled by the end of 2024 (calendar year). By accelerating the initiatives to reduce energy consumption and adoption of renewable energy, SDT will continue to run on 100% renewable energy even after Building 4 goes into full operation.

“With the completion of Building 4, we are very pleased to be able to deliver to more customers, a product line-up whose market is expected to expand over the medium to long term,” said Takeshi Matsuda, Managing Director of Sony Device Technology (Thailand) Co., Ltd. “As an overseas manufacturing site of Sony Semiconductor Solutions Group, SDT will contribute to the sustainable evolution of Sony’s business as well as society.”

 

Sony Device Technology (Thailand) Co., Ltd.  (Bangkadi)

Location

140 Moo.5 Bangka di Industrial Park Tiwanon Road,

Tambol Bangkadi Amphur Muang, Pathumthani 12000, Thailand

Start of Operation

December 1989

Representative

Takeshi Matsuda Managing Director

Major Products

Image sensor assembly etc.

Total Site Area

137,252

Headcount

Approx. 1,600 As of March 1, 2024

 

 Outline of Building 4 (As of March 2024)

Start of clean room operation

January 2024

Total floor area

66,370 (Including Utility Building area)

Clean room area

8,800 (1 floor)

(When implemented in all 3 floors: 26,400 (plan))

Major products

Image sensors for automotive applications,

Display devices, Laser diodes (assembly process)

 

 

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